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  4. Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications
 
research article

Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications

Receveur, R.
•
Zickar, M.
•
Marxer, C.
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2006
Journal of Micromechanics and Microengineering

We have designed a wafer level chip scale package for a bi-stable SOI-MEMS dc switch using a silicon-glass hermetic seal with through the lid feedthroughs. Bonded at 365 °C, 230 V and 250 kg, they pass the fine/gross leak test after thermal cycling and mechanical shock/vibration according to MIL-STD-833, fulfilling the requirements for biomedical applications. The measured shear strength is 114 26 N in correspondence with the theoretically expected 100 N. Ruthenium microcontacts are a factor of 100 more robust than gold microcontacts, being stable over 106 cycles measured in a N2 atmosphere inside the package presented here. Future work will include a more extensive bond quality assessment and continued microcontact reliability measurements. © 2006 IOP Publishing Ltd.

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Type
research article
DOI
10.1088/0960-1317/16/4/002
Author(s)
Receveur, R.
•
Zickar, M.
•
Marxer, C.
•
Larik, V.
•
de Rooij, N. F.  
•
Receveur, R.A.M.
Date Issued

2006

Published in
Journal of Micromechanics and Microengineering
Volume

16

Issue

4

Start page

676

End page

683

Note

364

Peer reviewed

REVIEWED

Written at

OTHER

EPFL units
SAMLAB  
Available on Infoscience
May 12, 2009
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/39716
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