conference presentation
Assessement of interfacial layer materials to maximize Thermal Boundary Conductance between copper and diamond
2011
Type
conference presentation
Author(s)
Date Issued
2011
Written at
EPFL
EPFL units
Event name | Event place | Event date |
Montpellier, France | September 15, 2011 | |
Available on Infoscience
October 25, 2011
Use this identifier to reference this record