conference presentation
Assessement of interfacial layer materials to maximize Thermal Boundary Conductance between copper and diamond
2011
Type
conference presentation
Author(s)
Date Issued
2011
Written at
EPFL
EPFL units
| Event name | Event place | Event date |
Montpellier, France | September 15, 2011 | |
Available on Infoscience
October 25, 2011
Use this identifier to reference this record