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  4. Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices
 
conference paper

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices

Rossi, Chiara  
•
Sallese, Jean-Michel  
January 1, 2019
2019 Latin American Electron Devices Conference (Laedc)
Latin American Electron Devices Conference (LAEDC)

We present SPICE simulations of a CMOS APS pixel element consisting of the optical sensor and the circuit. The photodiode is simulated at the physics level by means of the so-called generalized devices, without any predefined compact model. Conversely, regular compact models are used for MOSFETs. Modeling with Generalized Devices takes into account in SPICE simulations both the layout and the physics of the photodiode, that is drift-diffusion transport, optical generation and recombination of excess carriers, capacitive effects and surface recombination. This approach is supported by T CAD simulations and opens the way to full SPICE simulation of Active Pixel Sensor down to the semiconductor level.

  • Details
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Type
conference paper
DOI
10.1109/LAED.2019.8714732
Web of Science ID

WOS:000470767000016

Author(s)
Rossi, Chiara  
Sallese, Jean-Michel  
Date Issued

2019-01-01

Publisher

IEEE

Publisher place

New York

Published in
2019 Latin American Electron Devices Conference (Laedc)
ISBN of the book

978-1-7281-2216-8

Start page

72

End page

75

Subjects

Engineering, Electrical & Electronic

•

Engineering

•

aps

•

image sensor

•

optoelectronics

•

photodiode

•

spice

•

generalized devices

•

minority carriers

•

silicon

•

substrate

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
EDLAB  
Event nameEvent placeEvent date
Latin American Electron Devices Conference (LAEDC)

Armenia, COLOMBIA

February 24-27, 2019

Available on Infoscience
June 24, 2019
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/158427
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