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research article

Theoretical explanation of passivation behavior in OFP-Cu and OF-Cu

Ning, Zhiyuan
•
Wen, Du  
•
Zhou, Qulan
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June 1, 2024
Acta Materialia

This research presents a comprehensive comparative analysis of the passivation kinetics of OFP-Cu and OF-Cu in simulated repository electrolyte. The study employs a range of techniques, including potentiodynamic polarization, multi-step potentiostatic polarization, electrochemical impedance spectroscopy, and Mott-Schottky analysis, to explore the intricacies of corrosion behavior. The Point Defect Model (PDM) is used to interpret the steady-state physicochemical processes. Utilizing the results of PDM optimization, defect distribution diagrams within the passivation film were constructed, shedding light on the pivotal transition from p-type to n-type semiconductor properties of the film. The study concludes with an interpretation of the experimental data, highlighting the enhancement of copper's corrosion resistance due to phosphorus doping, as elucidated by the Solute-Vacancy Interaction Model.

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Type
research article
DOI
10.1016/j.actamat.2024.119882
Web of Science ID

WOS:001225970600001

Author(s)
Ning, Zhiyuan
•
Wen, Du  
•
Zhou, Qulan
•
Li, Na
•
Macdonald, Digby D.
Date Issued

2024-06-01

Publisher

Pergamon-Elsevier Science Ltd

Published in
Acta Materialia
Volume

271

Article Number

119882

Subjects

Technology

•

Copper

•

Point Defect Model

•

Corrosion

•

Electrochemical Impedance

•

Barrier Layer

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
SCI-STI-FM  
FunderGrant Number

SSM of Sweden

3030045-55

Available on Infoscience
June 5, 2024
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/208408
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