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  4. Wafer-scale Manufacturing of Ultra-low Loss, High-density Si<inf>3</inf>N<inf>4</inf> Photonic Integrated Circuits
 
conference paper

Wafer-scale Manufacturing of Ultra-low Loss, High-density Si3N4 Photonic Integrated Circuits

Ji, Xinru  
•
Wang, Rui Ning  
•
Qiu, Zheru  
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2023
CLEO: Applications and Technology, CLEO:A and T 2023
CLEO: Applications and Technology

We demonstrate Si3N4 photonic integrated circuits featuring ultra-low propagation loss and tight optical confinement, fabricated with a subtractive process. We report an increase in propagation loss in Si3N4 waveguides after exposure to ultraviolet (UV) irradiation, and loss recovery following a rapid thermal anneal (RTA). We show an intrinsic quality factor as high as 20×106 at 1.55 µm across a 100 mm wafer.

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Type
conference paper
DOI
10.1364/CLEO_AT.2023.AM2R.2
Scopus ID

2-s2.0-85191451629

Author(s)
Ji, Xinru  

École Polytechnique Fédérale de Lausanne

Wang, Rui Ning  

École Polytechnique Fédérale de Lausanne

Qiu, Zheru  

École Polytechnique Fédérale de Lausanne

Kippenberg, Tobias J.  

École Polytechnique Fédérale de Lausanne

Date Issued

2023

Publisher

Optical Society of America

Published in
CLEO: Applications and Technology, CLEO:A and T 2023
ISBN of the book

9781957171258

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LPQM1  
LPQM2  
Event nameEvent acronymEvent placeEvent date
CLEO: Applications and Technology

San Jose, United States

2023-05-07 - 2023-05-12

FunderFunding(s)Grant NumberGrant URL

EPFL center of MicroNanoTechnology

Air Force Office of Scientific Research

FA9550-19-1-0250

EU H2020 research and innovation program

965124

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Available on Infoscience
January 26, 2025
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/244792
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