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  4. Leak rate and reliability of low temperature thin-film indium bonding
 
conference paper

Leak rate and reliability of low temperature thin-film indium bonding

Straessle, R.
•
Pétremand, Y.  
•
Briand, D.  
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2013
Proceedings of Transducers 2013
Transducers 2013
  • Details
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Type
conference paper
DOI
10.1109/Transducers.2013.6626891
Author(s)
Straessle, R.
•
Pétremand, Y.  
•
Briand, D.  
•
de Rooij, N. F.  
Date Issued

2013

Published in
Proceedings of Transducers 2013
Volume

1

Start page

814

End page

817

Editorial or Peer reviewed

NON-REVIEWED

Written at

EPFL

EPFL units
SAMLAB  
Event nameEvent placeEvent date
Transducers 2013

Barcelona, Spain

June 17-20, 2013

Available on Infoscience
April 23, 2014
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/102937
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