Repository logo

Infoscience

  • English
  • French
Log In
Logo EPFL, École polytechnique fédérale de Lausanne

Infoscience

  • English
  • French
Log In
  1. Home
  2. Academic and Research Output
  3. Journal articles
  4. Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods
 
review article

Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Mariello, Massimo  
•
Kim, Kyungjin  
•
Wu, Kangling  
Show more
July 20, 2022
Advanced Materials

Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine long-term performance and biointegration in vivo. Here, recent advances in novel encapsulations to protect flexible versions of such systems from the surrounding biological environment are reviewed, focusing on material strategies and synthesis techniques. Considerable effort is put on thin-film encapsulation (TFE), and specifically organic-inorganic multilayer architectures as a flexible and conformal alternative to conventional rigid cans. TFE is in direct contact with the biological medium and thus must exhibit not only biocompatibility, inertness, and hermeticity but also mechanical robustness, conformability, and compatibility with the manufacturing of microfabricated devices. Quantitative characterization methods of the barrier and mechanical performance of the TFE are reviewed with a particular emphasis on water-vapor transmission rate through electrical, optical, or electrochemical principles. The integrability and functionalization of TFE into functional bioelectronic interfaces are also discussed. TFE represents a must-have component for the next-generation bioelectronic implants with diagnostic or therapeutic functions in human healthcare and precision medicine.

  • Details
  • Metrics
Type
review article
DOI
10.1002/adma.202201129
Web of Science ID

WOS:000827779700001

Author(s)
Mariello, Massimo  
Kim, Kyungjin  
Wu, Kangling  
Lacour, Stephanie P.  
Leterrier, Yves  
Date Issued

2022-07-20

Publisher

Wiley-V C H Verlag Gmbh

Published in
Advanced Materials
Article Number

2201129

Subjects

Chemistry, Multidisciplinary

•

Chemistry, Physical

•

Nanoscience & Nanotechnology

•

Materials Science, Multidisciplinary

•

Physics, Applied

•

Physics, Condensed Matter

•

Chemistry

•

Science & Technology - Other Topics

•

Materials Science

•

Physics

•

conformal encapsulation

•

flexible bioelectronics

•

organic

•

inorganic multilayers

•

permeability measuring systems

•

water-vapor transmission rate

•

atomic layer deposition

•

thin-film encapsulation

•

chemical-vapor-deposition

•

light-emitting-diodes

•

transparent barrier coatings

•

silicon-oxide layers

•

gas barrier

•

low-temperature

•

parylene c

•

mechanical-properties

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LPAC  
Available on Infoscience
August 1, 2022
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/189599
Logo EPFL, École polytechnique fédérale de Lausanne
  • Contact
  • infoscience@epfl.ch

  • Follow us on Facebook
  • Follow us on Instagram
  • Follow us on LinkedIn
  • Follow us on X
  • Follow us on Youtube
AccessibilityLegal noticePrivacy policyCookie settingsEnd User AgreementGet helpFeedback

Infoscience is a service managed and provided by the Library and IT Services of EPFL. © EPFL, tous droits réservés