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  4. Effect of Inlet Orifice on Saturated CHF and Flow Visualization in Multi-microchannel Heat Sinks
 
conference paper

Effect of Inlet Orifice on Saturated CHF and Flow Visualization in Multi-microchannel Heat Sinks

Park, Jung Eung  
•
Thome, John R.  
•
Michel, Bruno
2009
Twenty-Fifth Annual Ieee Semiconductor Thermal Measurement And Management Symposium
25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

This article investigates the effect of inlet orifices on saturated critical heat flux (CHF) in multi-microchannel heat sinks. Two different multi-microchannel heat sinks made in copper were tested with three low pressure refrigerants (R134a, R236fa, R245fa). One had 20 parallel rectangular microchannels of 467 x 4052 mu m (width x depth) while the other had 29 channels of 199 x 756 pm (width x depth). Flow visualization has been conducted with and without an orifice insert at the inlet of microchannels. Visualization confirmed the existence of flow instability, back flow and non-uniform distribution of flow among the channels when the insert with orifices was removed. Flow patterns in the microchannels and their evolution with increasing heat flux were observed. The flow boiling curves suggest that in the case of omitting the orifice, the boiling incipient occurred at a higher heat flux resulting in a higher overshoot of wall temperature. Moreover, the flow was easily subjected to instability and caused CHF to occur at much lower values than occurred with the orifices in place.

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Type
conference paper
DOI
10.1109/STHERM.2009.4810735
Web of Science ID

WOS:000268634800001

Author(s)
Park, Jung Eung  
Thome, John R.  
Michel, Bruno
Date Issued

2009

Publisher

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa

Published in
Twenty-Fifth Annual Ieee Semiconductor Thermal Measurement And Management Symposium
Start page

1

End page

8

Subjects

flow visualization

•

critical heat flux

•

flow boiling

•

instability

•

multi-microchannel

•

chip cooling

•

Cooling Technologies

•

Flux

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Event nameEvent placeEvent date
25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

San Jose, CA

Mar 15-19, 2009

Available on Infoscience
November 30, 2010
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/59981
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