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research article

Atomistic simulation of tensile strength and toughness of cracked Cu nanowires

Luque Gomez, Aitor  
•
Aldazabal, J.
•
Martinez-Esnaola, J. M.
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2006
Fatigue and Fracture of Engineering Materials and Structures

Virtual tensile experiments on cylindrical copper wires of nanometric diameter were carried out using molecular dynamics techniques based on the embedded-atom method. Transverse, atomically sharp surface cracks with circular fronts of different depths are introduced to evaluate their effect on the mechanical strength of the nanowires. The axisymmetric z-axis of the specimen is on the 001 direction of the nanowires. The analysis shows that, at 0 K, the cracked Cu nanowires behave in a ductile manner, their strength being determined by dislocation or twinning nucleation from the crack tip. Their calculated fracture toughness ranges from 0.6 to 3 MPa√m.

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  • Metrics
Type
research article
DOI
10.1111/j.1460-2695.2006.01037.x
Author(s)
Luque Gomez, Aitor  
Aldazabal, J.
Martinez-Esnaola, J. M.
Sevillano, J. Gil
Date Issued

2006

Publisher

Wiley-Blackwell

Published in
Fatigue and Fracture of Engineering Materials and Structures
Volume

29

Issue

8

Start page

615

End page

622

Editorial or Peer reviewed

REVIEWED

Written at

OTHER

EPFL units
IGM  
Available on Infoscience
November 19, 2014
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/108980
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