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research article

MOS Transistor Modeling for RF IC Design

Enz, C.  
•
Cheng, Y.
2000
IEEE Journal of Solid-State Circuits

This paper presents the basis of the modeling of the MOS transistor for circuit simulation at RF. A physical equivalent circuit that can easily be implemented as a Spice subcircuit is first derived. The subcircuit includes a substrate network that accounts for the signal coupling occurring at HF from the drain to the source and the bulk. It is shown that the latter mainly affects the output admittance y22. The bias and geometry dependence of the subcircuit components, leading to a scalable model, are then discussed with emphasis on the substrate resistances. Analytical expressions of the Y parameters are established and compared to measurements made on a 0.25-μm CMOS process. The Y parameters and transit frequency simulated with this scalable model versus frequency, geometry, and bias are in good agreement with measured data. The nonquasi-static effects and their practical implementation in the Spice subcircuit are then briefly discussed. Finally, a new thermal noise model is introduced. The parameters used to characterize the noise at HF are then presented and the scalable model is favorably compared to measurements made on the same devices used for the S-parameter measurement.

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Type
research article
DOI
10.1109/4.823444
Scopus ID

2-s2.0-0033879027

Author(s)
Enz, C.  
Cheng, Y.
Date Issued

2000

Published in
IEEE Journal of Solid-State Circuits
Volume

35

Issue

2

Start page

186

End page

201

Subjects

Device Modeling

•

MOST Modeling

•

RF

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LSI2  
Available on Infoscience
June 24, 2010
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/51127
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