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research article

Sputtered silicon carbide thin films as protective coating for MEMS applications

Ledermann, N.  
•
Baborowski, J.  
•
Muralt, P.  
Show more
2000
Surface & Coatings Technology

There is a need for chemically resistant coatings that protect the exposed surface of microfluidics components. Pinhole free films with low stress and a good uniformity on flat and inclined surfaces are required. In this study, amorphous silicon carbide (SiC) thin films have been deposited by RF magnetron sputtering on hat surfaces and into micromachined cavities of Si (100). The variation of RF power, deposition pressure and substrate bias voltage have been studied. Depending on the deposition conditions, the film stress can be adjusted from - 1400 MPa to + 100 MPa. Modifications of the deposition rate and the morphology between normal and inclined (54.7 degrees) planes have been observed. Optimal chemical stability was found with slightly compressive (-100 MPa) SiC thin films. No degradation of the protective layer has been observed after 3 h in KOH at 80 degrees C. (C) 2000 Elsevier Science S.A. All rights reserved.

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Type
research article
DOI
10.1016/S0257-8972(99)00568-X
Web of Science ID

WOS:000085945600046

Author(s)
Ledermann, N.  
Baborowski, J.  
Muralt, P.  
Xantopoulos, N.
Tellenbach, J. M.
Date Issued

2000

Published in
Surface & Coatings Technology
Volume

125

Issue

1-3

Start page

246

End page

250

Subjects

film stress

•

mems

•

protective coating

•

silicon carbide

Note

Ledermann, N Ecole Polytech Fed Lausanne, Lab Ceram, CH-1015 Lausanne, Switzerland Ecole Polytech Fed Lausanne, Lab Ceram, CH-1015 Lausanne, Switzerland Ecole Polytech Fed Lausanne, Lab Met Chim, CH-1015 Lausanne, Switzerland Mettler Toledo GmbH, CH-8606 Greifensee, Switzerland

295BG

Cited References Count:13

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LC  
Available on Infoscience
August 21, 2006
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/233426
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