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  4. Foil-to-foil Electrical Interconnection of Printed Capacitive Sensors Using Through Foil Vias and Anisotropic Conductive Adhesive Technologies
 
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conference paper

Foil-to-foil Electrical Interconnection of Printed Capacitive Sensors Using Through Foil Vias and Anisotropic Conductive Adhesive Technologies

Quintero, Vasquez  
•
Felipe, Andres
•
van Remoortere, Bart
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2012
Proceedings of LOPE-C
LOPE-C Large-Area Organic & Printed Electronics Convention
  • Details
  • Metrics
Type
conference paper
Author(s)
Quintero, Vasquez  
•
Felipe, Andres
•
van Remoortere, Bart
•
Molina-Lopez, Francisco
•
Smits, Edsger C. P.
•
van den Brand, Jeroen  
•
Briand, Danick  
•
Schoo, Herman F. M.
•
de Rooij, Nico  
Date Issued

2012

Published in
Proceedings of LOPE-C
Volume

1

Start page

275

End page

278

Peer reviewed

NON-REVIEWED

Written at

EPFL

EPFL units
SAMLAB  
Event nameEvent placeEvent date
LOPE-C Large-Area Organic & Printed Electronics Convention

Munich, Germany

June 11-13, 2012

Available on Infoscience
August 23, 2012
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/85016
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