There is some confusion in the literature about the material parameters for eutectic tin-lead solder. This is mainly caused by the varying parameters under which the samples are processed and treated prior to testing, which lead to different microstructures. For instance, most investigations are performed with bulk material, some with thin layers. However, the thickness of these layers measures over 100μm; and it is not known whether the material parameters determined on 100μm specimens are appropriate for solder layers of 30μm. This study focuses on the determination of the deformation behavior of thin layers, down to 25μm, of Sn62Pb36Ag2.