In this project, we have studied a new microchannel fabrication technique based on the idea of the transference of a thin layer of Si3N4 on top of grooves to form channels. In order to do so, we have created two different wafers. The first of them was a silicon wafer with grooves. We have covered this wafer with Si3N4 and cut it into chips. The other one was a Si wafer covered with Si3N4 on one of its sides. The wafer is cut into chips and thinned down to a thickness of about 50 um. Both processes have been carried out at a clean room. The next steps have taken place in a laboratory. In this environment, we have etched the Si from the Si3N4 chips until we had a thin layer of Si3N4 and transfer this layer on the top of the chips with grooves. After analyzing the complete microchannel chips with the microscope, we have concluded that this process can be a good alternative to existing fabrication techniques.