conference paper
High-Precision Aligned Silicon Wafer Bonding for a Micromachined AFM Sensor
1993
2nd Int. Symp. On Semiconductor Wafer Bonding: Science Technology and Applications
Type
conference paper
Author(s)
Date Issued
1993
Published in
2nd Int. Symp. On Semiconductor Wafer Bonding: Science Technology and Applications
Volume
93-29
Start page
363
End page
372
Editorial or Peer reviewed
NON-REVIEWED
Written at
OTHER
EPFL units
Available on Infoscience
May 12, 2009
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