Repository logo

Infoscience

  • English
  • French
Log In
Logo EPFL, École polytechnique fédérale de Lausanne

Infoscience

  • English
  • French
Log In
  1. Home
  2. Academic and Research Output
  3. Conferences, Workshops, Symposiums, and Seminars
  4. Experimental Characterization of Different Condenser Technologies in a Passive Two-Phase Cooling System for Thermal Management of Electronics
 
Loading...
Thumbnail Image
conference paper

Experimental Characterization of Different Condenser Technologies in a Passive Two-Phase Cooling System for Thermal Management of Electronics

Falsetti, Chiara  
•
Amalfi, Raffaele L.
•
Salamon, Todd
Show more
January 1, 2019
Proceedings Of The 2019 Eighteenth Ieee Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems (Itherm 2019)
18th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Passive two-phase, micro-channel cooling for thermal management of electronics represents an efficient and viable solution to augment conventional air-cooling systems with the potential for higher power dissipation densities, increased reliability, reduced power consumption and decreased noise levels. This paper focuses on the development of a novel thermosyphon-based cooling system for electronics. The target application is a telecommunications equipment shelf unit that comprises 18 circuit pack cards. The envisioned cooling system presented here is an infrastructure-independent, air-cooled thermosyphon loop consisting of an evaporator (cold plate), manufactured with 18 individual micro-channel zones (one per circuit pack card), and connected via riser and downcomer tubes to an air-cooled condenser. The total height of the thermosyphon loop, from mid-evaporator to mid-condenser, is approximately 50 cm. The main objective of this work is to assess the effect of different condenser technologies on the thermal-hydraulic performance of the thermosyphon; prior work examining the optimal design of the evaporator, riser and downcomer tubes has already been discussed in our previously published studies. A comprehensive experimental program was conducted to evaluate two different air-cooled condensers in a front-to-back air flow configuration: a single-pass, louvered-fin, flat-tube design and a multiple-pass, wavy-fin, circular-tube design. Thermosyphon experiments were carried out with R134a as the working fluid for filling ratios from 45% to 65%, imposed uniform and non-uniform heat loads from 102 W to 1023 W, fan speeds from 7302 min(-1) to 15480 min(-1), and fan tray configurations ranging from 5 to 7 fans. Test results demonstrate that the louvered-fin flat-tube condenser provides low liquid-side frictional pressure drops and thus high refrigerant mass flow rate in the loop, which is ideal for increasing power densities as it is more conservative with respect to dry-out phenomenon. On the other hand, the multiple-pass, wavy-fin, circular-tube condenser offers low thermosyphon thermal resistances in the entire region of heat loads, primarily due to the low air-side pressure drop.

  • Details
  • Metrics
Type
conference paper
DOI
10.1109/ITHERM.2019.8757231
Web of Science ID

WOS:000484930800175

Author(s)
Falsetti, Chiara  
•
Amalfi, Raffaele L.
•
Salamon, Todd
•
Marcinichen, Jackson B.
•
Thome, John R.  
Date Issued

2019-01-01

Publisher

IEEE

Publisher place

New York

Journal
Proceedings Of The 2019 Eighteenth Ieee Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems (Itherm 2019)
ISBN of the book

978-1-7281-2461-2

Series title/Series vol.

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Start page

1296

End page

1306

Subjects

air-cooled condenser

•

experimental characterization

•

passive two-phase cooling

•

r134a

•

thermal management

•

thermosyphon

•

thermosiphon loop

Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Event nameEvent placeEvent date
18th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Las Vegas, NV

May 28-31, 2019

Available on Infoscience
September 26, 2019
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/161555
Logo EPFL, École polytechnique fédérale de Lausanne
  • Contact
  • infoscience@epfl.ch

  • Follow us on Facebook
  • Follow us on Instagram
  • Follow us on LinkedIn
  • Follow us on X
  • Follow us on Youtube
AccessibilityLegal noticePrivacy policyCookie settingsEnd User AgreementGet helpFeedback

Infoscience is a service managed and provided by the Library and IT Services of EPFL. © EPFL, tous droits réservés