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  4. Metal diamond composites: Challenges in interface design
 
conference presentation

Metal diamond composites: Challenges in interface design

Weber, Ludger  
2014
Invited Talk

Metal-diamond composites have been identified as promising materials for applications in which high thermal conductivity and low coefficient of thermal expansion is required, e.g. applications of thermal management. Besides the intrinsic properties of the metal matrix and the diamond the load and heat transfer at their interface is key for the composite performance. The present talk gives an overview of the current state of the art of metal diamond composites for thermal management with focus on ways of improving interface heat and load transfer across the diamond metal interface.

  • Details
  • Metrics
Type
conference presentation
Author(s)
Weber, Ludger  
Date Issued

2014

Subjects

Metal diamond composites

•

Thermal management

•

thermal boundary conductance

•

surface modification

Written at

EPFL

EPFL units
LMM  
Event nameEvent placeEvent date
Invited Talk

EMPA, Dübendorf, Switzerland

June 16, 2014

Available on Infoscience
July 9, 2015
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/116173
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