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  4. Role Of A Liquid Accumulator In A Passive Two-Phase Liquid Cooling System For Electronics: Experimental Analysis
 
conference paper

Role Of A Liquid Accumulator In A Passive Two-Phase Liquid Cooling System For Electronics: Experimental Analysis

Lamaison, Nicolas  
•
Amalfi, Raffaele L.
•
Marcinichen, Jackson B.
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2017
Proceedings Of The Asme International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems, 2017
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Gravity-driven two-phase liquid cooling systems using flow boiling within micro-scale evaporators are becoming a game changing solution for electronics cooling. The optimization of the system's filling ratio can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm(3) is evaluated as the liquid accumulator for two different system volumes (associated to two different condensers). Results demonstrated that the liquid accumulator provided robust thermal performance as a function of filling ratio for the entire range of heat loads tested. In addition, the present liquid accumulator was more effective for a small volume system, 599 cm(3), than for a large volume system, 1169 cm(3), in which the relative size of the liquid accumulator increased from 12.8 % to 25% of the total system's volume.

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Type
conference paper
DOI
10.1115/IPACK2017-74020
Web of Science ID

WOS:000418396400029

Author(s)
Lamaison, Nicolas  
Amalfi, Raffaele L.
Marcinichen, Jackson B.
Thome, John R.  
Salamon, Todd
Date Issued

2017

Publisher

Amer Soc Mechanical Engineers

Publisher place

New York

Published in
Proceedings Of The Asme International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems, 2017
ISBN of the book

978-0-7918-5809-7

Total of pages

13

Series title/Series vol.

Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Start page

V001T02A001

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Event nameEvent placeEvent date
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

San Francisco, CA

AUG 29-SEP 01, 2017

Available on Infoscience
January 15, 2018
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/143816
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