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  4. Wafer Level Packaging of Micro-Machined Gas Sensors
 
conference paper

Wafer Level Packaging of Micro-Machined Gas Sensors

Raible, S.
•
Kappler, J.
•
Briand, D.  
2005
1st Internatinal Workshop on Smart Gas Sensors Technology and Application
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Type
conference paper
Author(s)
Raible, S.
Kappler, J.
Briand, D.  
Date Issued

2005

Published in
1st Internatinal Workshop on Smart Gas Sensors Technology and Application
Editorial or Peer reviewed

NON-REVIEWED

Written at

OTHER

EPFL units
SAMLAB  
Available on Infoscience
May 12, 2009
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/39711
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