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  4. Recent Advances in Thermal Modeling of Micro-Evaporators for Cooling of Microprocessors
 
conference paper

Recent Advances in Thermal Modeling of Micro-Evaporators for Cooling of Microprocessors

Thome, John Richard  
2007
Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B
ASME International Mechanical Engineering Congress and Exhibition (IMECE)
  • Details
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Type
conference paper
DOI
10.1115/IMECE2007-42900
Web of Science ID

WOS:000254515301059

Author(s)
Thome, John Richard  
Date Issued

2007

Published in
Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B
Start page

1583

End page

1592

Note

Keynote speaker

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LTCM  
Event nameEvent placeEvent date
ASME International Mechanical Engineering Congress and Exhibition (IMECE)

Seatle

November 10-16

Available on Infoscience
November 10, 2007
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/14585
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