conference paper
Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
2010
Proceedings of the 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Type
conference paper
Author(s)
Date Issued
2010
Published in
Proceedings of the 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Start page
1
End page
10
Editorial or Peer reviewed
REVIEWED
Written at
EPFL
EPFL units
| Event name | Event place | Event date |
Barcelona, Spain | October 6-8 | |
Available on Infoscience
April 7, 2011
Use this identifier to reference this record