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conference paper

Stretchable and deformable macroelectronics

Wagner, S.
•
Lacour, S. P.  
•
Hsu, P. H. I.
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2003
61st Device Research Conference.
61st IEEE Device Research Conference.

In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.

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Type
conference paper
DOI
10.1109/DRC.2003.1226929
Author(s)
Wagner, S.
Lacour, S. P.  
Hsu, P. H. I.
Sturm, J. C.
Suo, Z.
Date Issued

2003

Publisher

IEEE

Published in
61st Device Research Conference.
Start page

195

End page

197

Editorial or Peer reviewed

REVIEWED

Written at

OTHER

EPFL units
LSBI  
Event nameEvent placeEvent date
61st IEEE Device Research Conference.

Salt Lake City, UT, USA

June 23-25, 2003

Available on Infoscience
May 1, 2012
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/79883
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