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2004
MEMS 2004
Silicon Liquid Flow Sensor Encapsulation using Metal to Glass Anodic Bonding
conference paper
Type
conference paper
Author(s)
Date Issued
2004
Journal
MEMS 2004
Volume
1
Start page
649
End page
652
Peer reviewed
NON-REVIEWED
Written at
OTHER
EPFL units
Available on Infoscience
May 12, 2009
Use this identifier to reference this record