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  4. MOCVD of HfO2 and ZrO2 high-k gate dielectrics for InAlN/AlN/GaN MOS-HEMTs
 
research article

MOCVD of HfO2 and ZrO2 high-k gate dielectrics for InAlN/AlN/GaN MOS-HEMTs

Abermann, S.
•
Pozzovivo, G.
•
Kuzmik, J.
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2007
Semiconductor Science and Technology

We apply metal organic chemical vapour deposition (MOCVD) of HfO2 and of ZrO2 from beta-diketonate precursors to grow high-k gate dielectrics for InAlN/AlN/GaN metal oxide semiconductor (MOS)-high electron mobility transistors (HEMTs). High-k oxides of about 12 nm-14 nm are deposited for the MOS-HEMTs incorporating Ni/Au gates, whereas as a reference, Ni-contact-based 'conventional' Schottky-barrier (SB)-HEMTs are processed. The processed dielectrics decrease the gate current leakage of the HEMTs by about four orders of magnitude if compared with the SB-gated HEMTs and show superior device characteristics in terms of I-DS and breakdown.

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Type
research article
DOI
10.1088/0268-1242/22/12/005
Web of Science ID

WOS:000252190400005

Author(s)
Abermann, S.
Pozzovivo, G.
Kuzmik, J.
Strasser, G.
Pogany, D.
Carlin, J. F.  
Grandjean, N.  
Bertagnolli, E.
Date Issued

2007

Published in
Semiconductor Science and Technology
Volume

22

Issue

12

Start page

1272

End page

1275

Subjects

OXIDES

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LASPE  
Available on Infoscience
October 5, 2010
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/55024
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