Identification of amorphous silicon residues in a low power CMOS technology

Acovic, A; Buffat, PA; Brander, P; Jacob, P; Jeandupeux, O; Marsico, V; Rosenfeld, D; Moser, J; Kohli, M; Fluckiger, R; Belkacem, K; Fazan, P

doi:10.1117/12.361339

conference paper

Identification of amorphous silicon residues in a low power CMOS technology

Acovic, A

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Buffat, PA

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Brander, P

Ajuria, S

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Jakubczak, JF

1999

Proceedings of SPIE

in-line methods and monitors for process and yield improvement

A large variety of physical analysis techniques are used in the semiconductor industry to identify defects impacting yield or reliability. Identification of a defect often requires the combined use of several techniques to give a clear understanding of th