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  4. Topology Optimization of Soft Magnetic Composites with Integer Programming
 
conference paper

Topology Optimization of Soft Magnetic Composites with Integer Programming

Ren, Xiaotao  
•
Thabuis, Adrien  
•
Hannukainen, Antti
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January 1, 2022
Twentieth Biennial Ieee Conference On Electromagnetic Field Computation (Ieee Cefc 2022)
20th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)

Soft Magnetic Composites (SMCs) have huge application potential in electrical devices. With the development of additive manufacturing (AM), the properties of SMCs can be boosted. It is therefore required an optimization algorithm to design SMCs considering the AM capacity. Since the magnetic and loss properties of SMCs are highly sensitive to the shape evolution of the components, we introduce a topology optimization approach with integer programming. At each iteration, the components of the composite are determined with crisp boundary. This optimization algorithm converges rapidly because of the topology gradient and the optimal topology is reached.

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Type
conference paper
DOI
10.1109/CEFC55061.2022.9940778
Web of Science ID

WOS:000942521800132

Author(s)
Ren, Xiaotao  
Thabuis, Adrien  
Hannukainen, Antti
Corcolle, Romain
Perriard, Yves  
Date Issued

2022-01-01

Publisher

IEEE

Publisher place

New York

Published in
Twentieth Biennial Ieee Conference On Electromagnetic Field Computation (Ieee Cefc 2022)
ISBN of the book

978-1-6654-6833-6

Subjects

Computer Science, Interdisciplinary Applications

•

Engineering, Electrical & Electronic

•

Computer Science

•

Engineering

•

additive manufacturing (am)

•

adjoint

•

binary structure

•

gradient

•

solid isotropic material with penalization(simp)

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LAI  
Event nameEvent placeEvent date
20th Biennial IEEE Conference on Electromagnetic Field Computation (CEFC)

ELECTR NETWORK

Oct 24-26, 2022

Available on Infoscience
March 27, 2023
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/196478
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