Global interconnect design for threedimensional integrated circuits is a crucial task. Despitethe importance of this task, limited results related to global issues have been presented. Challenges in reliably distributing power, ground, and the clock signal within a multi-plane integrated system are discussed in this paper. The design of two 3-D test circuits addressing these issues is described. Candidate 3-D topologies for both power and clock distribution networks are also presented. Design implications due to the different design approaches are discussed. Experimental and simulation results of the 3-D clock and power distribution architectures, respectively, are provided. Both of the test circuits are fabricated by the 3-D fabrication process developed at MIT Lincoln Laboratories (MITLL). The design of the clock and power distribution networks is discussed