conference paper
RF-TSVs compatible with harsh-environment post-processing for “via-first” 3D integration
2013
Proceedings of Transducers 2013
Type
conference paper
Author(s)
Gueye, R.
•
Wee, S. W.
•
Vitale, W. A.
•
Truax, S.
•
•
Roman, C.
•
Ionescu, A.
•
Hierold, C.
•
•
Date Issued
2013
Published in
Proceedings of Transducers 2013
Volume
1
Start page
830
End page
833
Editorial or Peer reviewed
NON-REVIEWED
Written at
EPFL
EPFL units
| Event name | Event place | Event date |
Barcelona, Spain | June 17-20, 2013 | |
Available on Infoscience
April 23, 2014
Use this identifier to reference this record