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research article

Suppression of leakage currents in GaN-based LEDs induced by reactive-ion etching damages

Mosca, M.
•
Castiglia, A.  
•
Buhlmann, H. J.
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2008
European Physical Journal-Applied Physics

Forward and reverse leakage currents in GaN/InGaN multi-quantum well light-emitting diodes (LEDs) are caused by reactive-ion etching (RIE) damages during device patterning. A method to recover the damaged surfaces, based on a chemical etch in KOH: ethylene-glycol is described. Leakage currents decrease of more than a factor of 10 and are completely suppressed in most of devices.

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Type
research article
DOI
10.1051/epjap:2008119
Web of Science ID

WOS:000257337600007

Author(s)
Mosca, M.
Castiglia, A.  
Buhlmann, H. J.
Dorsaz, J.  
Feltin, E.
Carlin, J. F.  
Grandjean, N.  
Date Issued

2008

Published in
European Physical Journal-Applied Physics
Volume

43

Issue

1

Start page

51

End page

53

Subjects

LIGHT-EMITTING-DIODES

•

PLASMA-INDUCED DAMAGE

•

N-TYPE GAN

Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
LASPE  
Available on Infoscience
October 5, 2010
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/55101
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