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  4. Piezoresistive n-Type 4H-SiC Pressure Sensor with Membrane Formed by Mechanical Milling
 
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conference paper

Piezoresistive n-Type 4H-SiC Pressure Sensor with Membrane Formed by Mechanical Milling

Akiyama, Terunobu  
•
Briand, Danick  
•
de Rooij, Nico  
2011
Proceedings of IEEE Sensors
IEEE Sensors 2011

A 4H-SiC pressure sensor with piezoresistive transducers, for harsh environment applications, e.g., high temperature (~650°C) and/or in corrosive chemicals is presented. The sensing membrane, 1 mm in diameter and 50 µm in thickness, was formed by milling (drilling) a bulk single crystal SiC wafer. Both transverse and longitudinal piezoresistors were formed on the membrane out of an n-type SiC epitaxial layer. Ohmic contacts were obtained with Ta/Ni/Pt metallization followed by annealing at 1000°C for 20 min. The sensor was assembled on a small board and characterized under hydrostatic pressures up to 60 bar at room temperature. The obtained pressure sensitivity was 268 µV/V/bar. The sensor chip was exposed in air at 600°C for 165 hours and changes in bridge resistance were measured.

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Type
conference paper
DOI
10.1109/ICSENS.2011.6126936
Web of Science ID

WOS:000299901200055

Author(s)
Akiyama, Terunobu  
•
Briand, Danick  
•
de Rooij, Nico  
Date Issued

2011

Publisher

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa

Published in
Proceedings of IEEE Sensors
Start page

222

End page

225

Peer reviewed

NON-REVIEWED

Written at

EPFL

EPFL units
SAMLAB  
Event nameEvent placeEvent date
IEEE Sensors 2011

Limerik, Ireland

October 28-31, 2011

Available on Infoscience
November 21, 2011
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/72719
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