conference presentation
Droplet-on-Demand Inkjet-filled TSVs as a Pathway to Cost-efficient Chip Stacking
2013
Type
conference presentation
Author(s)
Date Issued
2013
Written at
OTHER
EPFL units
| Event name | Event place | Event date |
Orlando, FL, USA | 30 September – 3 October, 2013 | |
Available on Infoscience
July 8, 2015
Use this identifier to reference this record