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  4. Silicon micromachined ultrasonic transducer for cutting applications with improved power transfer
 
conference paper

Silicon micromachined ultrasonic transducer for cutting applications with improved power transfer

Friedrich, F.
•
Lockhart, R.  
•
Briand, D.  
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2012
Proceedings of IEEE International Ultrasonics Symposium IUS
IEEE International Ultrasonics Symposium IUS
  • Details
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Type
conference paper
Author(s)
Friedrich, F.
•
Lockhart, R.  
•
Briand, D.  
•
Isarakorn, D.  
•
Margairaz, P.
•
Sandoz, J.-P.
•
Brossard, J.
•
Keppner, H.
•
Olson, W.
•
Dietz, T.
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Date Issued

2012

Published in
Proceedings of IEEE International Ultrasonics Symposium IUS
Volume

1

Start page

1169

End page

1172

Editorial or Peer reviewed

NON-REVIEWED

Written at

EPFL

EPFL units
SAMLAB  
Event nameEvent placeEvent date
IEEE International Ultrasonics Symposium IUS

Dresden, Germany

Oct 7-10, 2012

Available on Infoscience
May 17, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/92291
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