Method for flattening substrates or layers using 3d printing and etching
The present invention concerns a layer or substrate flattening method comprising the steps of: - providing a layer or substrate (1) to be flattened; - measuring a topography or surface profile of at least one area (3) of the layer or substrate to be flattened; - providing at least one etch layer (5A) on at least one area of the layer or substrate to be flattened; - defining a topography (7) of said at least one etch layer, said topography to be exposed to etching; and - etching the at least one etch layer comprising the defined topographic surface and the at least one area of the layer or substrate to provide a flattened surface on the at least one area of the layer or substrate.
72944188
Alternative title(s) : (fr) ProcƩdƩ d'aplatissement de substrats ou de couches par gravure et impression 3d
TTO:6.1869.1
Patent number | Country code | Kind code | Date issued |
WO2021053579 | WO | A1 | 2021-03-25 |