LSM - Microelectronic Systems Laboratory
15:01Copper TSV-Based Die-Level Via-Last 3D Integration Process with Parylene-C Adhesive Bonding Technique. The IEEE International Conference on 3D System Integration (3DIC), San Francisco, California, USA, November 9-11, 2016.
16:25Effect of metal buffer layer and thermal annealing on HfOx-based ReRAMs. International Conference on the Science of Electrical Engineering (ICSEE), Eilat, Israel, September 16-18 November, 2016.
14:14High frequency self-oscillating current switching for a fully integrated fail-safe stimulator output stage. 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), Lisbon, Portugal, 27-30 June 2016.
15:54Graphene Field Effect Devices and Circuits: Theory and Fabrication. Thèse EPFL, n° 7356 (2016)
14:34Determination of the Elastic Behavior of Silicon Nanowires within a Scanning Electron Microscope, in Journal Of Nanomaterials, p. 4905838, 2016.
19:10A Digital Spectrum Shaping Signaling Serial-Data Transceiver with Crosstalk and ISI Reduction Property in Multi-Drop Interfaces, in IEEE Transactions on Circuits and Systems II: Express Briefs, vol. 63, num. 12, p. 1126-1130, 2016.
19:16Large-scale neural networks implemented with non-volatile memory as the synaptic weight element: impact of conductance response. European Solid-State Device Research Conference (ESSDERC) 2016, Lausanne, Switzerland, September 12-16, 2016.
00:19Architectural Modeling of a Multi-Tone/Single-Sideband Serial Link Transceiver for Lossy Wireline Data Links. IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2016), Jeju, Korea, October 25-28, 2016.
17:30Motion Vector Estimation of Textureless Objects Exploiting Reaction-Diffusion Cellular Automata, in International Journal Of Unconventional Computing, vol. 12, num. 2-3, p. 169-187, 2016.
11:11Thermal Issues in Deep Sub-Micron FDSOI Circuits. 12th Conference on PhD Research in Microelectronics and Electronics (PRIME 2016), Lisbon, Portugal, June 27-30, 2016.