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  4. Advanced Sensor Systems by Low-Temperature Heterogeneous 3D Integration Processes
 
conference paper

Advanced Sensor Systems by Low-Temperature Heterogeneous 3D Integration Processes

Fernandez-Bolanos, Montserrat  
•
Muller, Andrei  
•
Weber, Josef
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January 1, 2018
2018 Symposium On Design, Test, Integration & Packaging Of Mems And Moems (Dtip)
20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP)

A few application demonstrators of heterogeneous 3D integrated systems including innovative nanosensors for gas detection and biofludic applications have been successfully implemented showing efficient low-temperature heterogeneous integration processes, miniaturization, low power consumption, extremely low detection limits (5 ppm) and novel functionalities very interesting for smart sensors in automotive and healthcare applications.

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Type
conference paper
DOI
10.1109/DTIP.2018.8394203
Web of Science ID

WOS:000468341300023

Author(s)
Fernandez-Bolanos, Montserrat  
Muller, Andrei  
Weber, Josef
Ramm, Peter
Date Issued

2018-01-01

Publisher

IEEE

Publisher place

New York

Published in
2018 Symposium On Design, Test, Integration & Packaging Of Mems And Moems (Dtip)
ISBN of the book

978-1-5386-6199-4

Subjects

Engineering, Electrical & Electronic

•

Engineering, Mechanical

•

Engineering

•

low-temperature bonding

•

through silicon vias (is v)

•

solid-liquid interdiffusion (slid)

•

fet-based sensors

•

cnt-based gas sensor

•

heterogeneous 3d integration

•
Editorial or Peer reviewed

REVIEWED

Written at

EPFL

EPFL units
NANOLAB  
Event nameEvent placeEvent date
20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP)

Roma, ITALY

May 22-25, 2018

Available on Infoscience
June 18, 2019
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/157037
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