Currently, wafer-fusion technology represents an effective technique for enhancing the performance of long-wavelength vertical cavity surface-emitting lasers (VCSELs) based on classical double heterostructures with multi-quantum well active regions. Using the example of 1310 nm wavelength VCSELs, we demonstrate the status of this technology for wafer-level scale, wavelength-controlled devices with high performance, capable of operation in a wide temperature range up to 90 degrees C with single-mode output power levels in excess of 1 mW and a side mode suppression ratio (SMSR) in excess of 40 dB. No degradation was observed in a qualification lot that operated at 10 mA and 90 degrees C for 2000 h.